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SN74CB3Q3384ADGVR - Texas Instruments

Description: 10-Bit 2.5-V/3.3-V Low-Voltage FET Bus Switch

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SN74CB3Q3384ADGVR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - dgv(r-pdso-g24)
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SN74CB3Q3384ADGVR - Texas Instruments  - 3D model - Small Outline Packages - dgv(r-pdso-g24)
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SN74CB3Q3384ADGVR Details

  • Manufacturer Part Number:

    SN74CB3Q3384ADGVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    24

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES WITH 3.3V SUPPLY

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    CB3Q/3VH/3C/2B

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    10

  • Number of Functions:

    10

  • Number of Ports:

    2

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    2 mA

  • Prop. Delay@Nom-Sup:

    0.15 ns

  • Propagation Delay (tpd):

    0.15 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

SN74CB3Q3384ADGVR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE03, which includes guidelines for signal routing, decoupling, and thermal management to ensure optimal performance and minimize signal integrity issues.
  • The SN74CB3Q3384ADGVR has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure that the thermal pad is connected to a copper pour on the PCB, and consider using thermal vias to improve heat dissipation. Additionally, follow the recommended PCB layout guidelines to minimize thermal resistance.
  • The maximum operating frequency of the SN74CB3Q3384ADGVR is 500 MHz, but this can vary depending on the specific application and signal integrity requirements. It's recommended to consult the datasheet and application notes for more information on frequency planning and signal integrity.
  • To ensure signal integrity, follow the recommended PCB layout guidelines, use controlled impedance traces, and consider using signal termination resistors. Additionally, ensure that the power supply is well-regulated and decoupled to minimize noise and jitter.
  • The recommended power-up sequence for the SN74CB3Q3384ADGVR is to power up the VCC supply before the VCCA supply. This ensures that the internal voltage regulators are properly initialized and that the device operates correctly.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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