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SN74CB3T3383DGVR - Texas Instruments

Description: 10-Bit FET Bus-Exchange Switch 2.5-V/3.3-V Low-Voltage Bus Switch with 5-V-Tolerant Level Shifter

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SN74CB3T3383DGVR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGV (R-PDSO-G24)
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SN74CB3T3383DGVR - Texas Instruments  - 3D model - Small Outline Packages - DGV (R-PDSO-G24)
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SN74CB3T3383DGVR Details

  • Manufacturer Part Number:

    SN74CB3T3383DGVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    TVSOP-24

  • Pin Count:

    24

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    CB3T/3VT

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    10

  • Number of Ports:

    4

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.02 mA

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

SN74CB3T3383DGVR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE03, which includes guidelines for signal routing, decoupling, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The SN74CB3T3383DGVR has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal via array or a copper pour with multiple vias can be used to connect the thermal pad to the thermal plane. Additionally, the PCB should be designed to minimize thermal resistance and ensure good airflow around the device.
  • The maximum operating frequency of the SN74CB3T3383DGVR is not explicitly stated in the datasheet, but it is typically limited by the signal propagation delay and the clock-to-output delay. According to the datasheet, the maximum clock frequency is 250 MHz, but the actual operating frequency may be lower depending on the specific application and PCB design.
  • To ensure signal integrity, it is recommended to use controlled impedance traces, minimize signal routing distances, and use signal termination resistors as needed. Additionally, the PCB should be designed to minimize electromagnetic interference (EMI) and radio-frequency interference (RFI) by using shielding, grounding, and decoupling techniques.
  • The recommended power sequencing for the SN74CB3T3383DGVR is to power up the VCC supply before the VCCA supply, and to power down the VCCA supply before the VCC supply. This ensures that the internal voltage regulators are properly initialized and avoids any potential latch-up or damage to the device.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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