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SN74CBTLV3257DRE4 - Texas Instruments

Description: Encoders, Decoders, Multiplexers & Demultiplexers SINGLE INVERTER

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SN74CBTLV3257DRE4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G16)
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SN74CBTLV3257DRE4 - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G16)
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SN74CBTLV3257DRE4 Details

  • Manufacturer Part Number:

    SN74CBTLV3257DRE4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Country Of Origin:

    Mexico

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    CBTLV/3B

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    9.9 mm

  • Load Capacitance (CL):

    30 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    4

  • Number of Ports:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    0.15 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

SN74CBTLV3257DRE4 Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the SN74CBTLV3257DRE4 is 250 MHz, but it can vary depending on the specific application and operating conditions.
  • To ensure signal integrity, it's essential to follow proper PCB design and layout guidelines, such as using controlled impedance traces, minimizing signal routing, and using termination resistors as needed. Additionally, consider using simulation tools to analyze signal integrity and make adjustments as necessary.
  • Yes, the SN74CBTLV3257DRE4 can be used in a 3.3V system. The recommended power supply voltage range is 2.3V to 3.6V, with a typical operating voltage of 3.3V. Ensure that the power supply is stable and within the recommended range to ensure proper device operation.
  • Thermal management is crucial for the SN74CBTLV3257DRE4. Ensure good airflow around the device, and consider using a heat sink or thermal pad if the device is expected to operate at high temperatures or in high-power applications. The device has a maximum junction temperature of 150°C, so it's essential to keep the operating temperature below this threshold.
  • The SN74CBTLV3257DRE4 has built-in ESD protection and latch-up prevention measures. The device features electrostatic discharge (ESD) protection up to 2 kV per the human-body model (HBM) and 1 kV per the charged-device model (CDM). Additionally, the device has latch-up protection to prevent damage from excessive currents.

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SN74CBTLV3257DRE4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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