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SN74GTL2003PW - Texas Instruments

Description: Voltage Level Translator GTL/GTL+ to LVTTL/TTL 20-Pin TSSOP Tube

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SN74GTL2003PW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW
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SN74GTL2003PW - Texas Instruments  - 3D model - Small Outline Packages - PW
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SN74GTL2003PW Details

  • Manufacturer Part Number:

    SN74GTL2003PW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    20

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Delay-Max:

    5.5 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

SN74GTL2003PW Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE03, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The SN74GTL2003PW has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the thermal plane.
  • The SN74GTL2003PW is rated for operation from -40°C to 85°C, but it can be derated for operation up to 100°C with reduced performance and reliability.
  • To ensure signal integrity, use controlled impedance traces, minimize trace length and stubs, and use termination resistors as recommended in the datasheet. Additionally, use a signal integrity analysis tool to simulate and optimize the design.
  • The SN74GTL2003PW is a commercial-grade device, but Texas Instruments offers a radiation-hardened version, the RHGTL2003PW, which is designed for high-reliability and aerospace applications.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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