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SN74GTLP1394PW - Texas Instruments

Description: Texas Instruments SN74GTLP1394PW, 1 Bus Transceiver, Bus Transceiver, 2-Bit Inverting LVTTL, 16-Pin TSSOP

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SN74GTLP1394PW - Texas Instruments - PCB symbol
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SN74GTLP1394PW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW
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SN74GTLP1394PW - Texas Instruments - 3D model - Small Outline Packages - PW
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SN74GTLP1394PW Details

  • Manufacturer Part Number:

    SN74GTLP1394PW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Control Type:

    INDEPENDENT CONTROL

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    GTLP

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS TRANSCEIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    CONFIGURABLE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    20 mA

  • Prop. Delay@Nom-Sup:

    9 ns

  • Propagation Delay (tpd):

    9 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    0.79 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

SN74GTLP1394PW Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note 'SN74GTLP1394PW PCB Layout Guidelines' (SLVAE04). It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
  • The SN74GTLP1394PW has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink if necessary. Refer to the 'Thermal Management' section in the datasheet for more information.
  • The SN74GTLP1394PW is specified to operate up to 1.5 GHz, but the actual operating frequency may be limited by the system design, PCB layout, and signal integrity. It's essential to perform signal integrity analysis and simulation to ensure the device operates within its specifications.
  • To ensure signal integrity, follow the guidelines in the 'Signal Integrity' section of the datasheet. This includes using controlled impedance traces, minimizing trace lengths, and using terminations as recommended. Additionally, perform signal integrity analysis and simulation using tools like IBIS-AMI models or SPICE simulations.
  • The SN74GTLP1394PW requires a specific power sequencing to ensure proper operation. The VCC supply should be powered up before the VCCA supply, and the VCCA supply should be powered down before the VCC supply. Refer to the 'Power Sequencing' section in the datasheet for more information.

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SN74GTLP1394PW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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