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SN74GTLPH16912GR - Texas Instruments

Description: 18-Bit LVTTL-to-GTLP Universal Bus Transceiver

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SN74GTLPH16912GR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG0056A
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SN74GTLPH16912GR - Texas Instruments  - 3D model - Small Outline Packages - DGG0056A
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SN74GTLPH16912GR Details

  • Manufacturer Part Number:

    SN74GTLPH16912GR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    56

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    1999-11-10

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Control Type:

    INDEPENDENT CONTROL

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    GTLP

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    REGISTERED BUS TRANSCEIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    18

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    6.5 ns

  • Propagation Delay (tpd):

    6.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    0.79 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Type:

    POSITIVE EDGE

  • Width:

    6.1 mm

SN74GTLPH16912GR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for signal routing, decoupling, and thermal management to ensure optimal performance and minimize signal integrity issues.
  • The SN74GTLPH16912GR has a thermal pad that must be connected to a solid ground plane on the PCB to dissipate heat. A thermal via array or a thermal pad connected to a heat sink can be used to improve thermal management. Refer to the application note SLVAE04 for more details.
  • The maximum operating frequency for the SN74GTLPH16912GR is 800 MHz, but it can vary depending on the specific application and signal integrity requirements. It's recommended to consult with Texas Instruments' application engineers or perform simulations to determine the maximum operating frequency for a specific design.
  • To ensure signal integrity, it's recommended to follow the guidelines in the application note SLVAE04, which includes recommendations for signal routing, termination, and decoupling. Additionally, simulations using tools like IBIS-AMI models or SPICE models can help to identify and mitigate signal integrity issues.
  • The recommended power sequencing for the SN74GTLPH16912GR is to power up the VCCIO and VCC cores simultaneously, followed by the input signals. This ensures that the device is properly initialized and minimizes the risk of latch-up or other power-related issues.

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SN74GTLPH16912GR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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