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SN74GTLPH306DGVR - Texas Instruments

Description: 8-Bit LVTTL-to-GTLP Bus Transceiver

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SN74GTLPH306DGVR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGV (R-PDSO-G24)
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SN74GTLPH306DGVR - Texas Instruments  - 3D model - Small Outline Packages - DGV (R-PDSO-G24)
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SN74GTLPH306DGVR Details

  • Manufacturer Part Number:

    SN74GTLPH306DGVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    24

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Control Type:

    COMMON CONTROL

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    GTLP

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS TRANSCEIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    20 mA

  • Prop. Delay@Nom-Sup:

    7.5 ns

  • Propagation Delay (tpd):

    7.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    0.79 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

SN74GTLPH306DGVR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE03, which includes guidelines for signal routing, decoupling, and thermal management to ensure optimal performance and minimize signal integrity issues.
  • The SN74GTLPH306DGVR has a thermal pad that must be connected to a solid ground plane to dissipate heat. A thermal via array or a thermal pad connected to a heat sink can be used to improve thermal performance. Refer to the application note SLVAE03 for more details.
  • The maximum operating frequency for the SN74GTLPH306DGVR is 3.2 GHz, but it can vary depending on the specific application and signal integrity requirements. It's recommended to consult with Texas Instruments' application engineers for specific guidance on frequency planning.
  • Signal integrity can be ensured by following proper PCB layout guidelines, using controlled impedance traces, and minimizing signal reflections. Texas Instruments provides signal integrity models and simulation tools to help designers optimize their designs.
  • The recommended power sequencing for the SN74GTLPH306DGVR is to power up the VCCIO pins before the VCCCA pins. This ensures that the internal voltage regulators are properly initialized and that the device operates within its specified voltage ranges.

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SN74GTLPH306DGVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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