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SN74GTLPH306DWR - Texas Instruments

Description: 8-Bit LVTTL-to-GTLP Bus Transceiver

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SN74GTLPH306DWR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW (R-PDSO-G24)
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SN74GTLPH306DWR - Texas Instruments  - 3D model - Small Outline Packages - DW (R-PDSO-G24)
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SN74GTLPH306DWR Details

  • Manufacturer Part Number:

    SN74GTLPH306DWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    24

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Control Type:

    COMMON CONTROL

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    GTLP

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e4

  • Length:

    15.4 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS TRANSCEIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP24,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    20 mA

  • Prop. Delay@Nom-Sup:

    7.5 ns

  • Propagation Delay (tpd):

    7.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    0.79 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

SN74GTLPH306DWR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVA883, which includes guidelines for signal routing, decoupling, and thermal management to ensure optimal performance and minimize signal integrity issues.
  • The SN74GTLPH306DWR has a thermal pad that must be connected to a solid ground plane to dissipate heat. A thermal via array or a thermal pad connected to a heat sink can be used to improve thermal performance. Refer to the application note SLVA883 for more details.
  • The maximum operating frequency for the SN74GTLPH306DWR is 800 MHz, but it can be limited by the system's signal integrity, PCB layout, and termination. It's recommended to perform signal integrity analysis and simulation to determine the maximum operating frequency for a specific application.
  • While the SN74GTLPH306DWR is designed for GTL systems, it can be used in non-GTL systems with proper termination and signal conditioning. However, the device's performance and signal integrity may be compromised, and additional circuitry may be required to ensure compatibility.
  • The recommended termination scheme for the SN74GTLPH306DWR is a 50-ohm resistive termination to VCC or VEE, depending on the application. Refer to the datasheet and application note SLVA883 for more details on termination schemes and signal integrity considerations.

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SN74GTLPH306DWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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