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SN74LVCR32245AZKER - Texas Instruments

Description: 32-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS

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PCB Footprints
SN74LVCR32245AZKER - Texas Instruments PCB footprint - BGA - BGA - ZKE (R-PBGA-N96)
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SN74LVCR32245AZKER - Texas Instruments  - 3D model - BGA - ZKE (R-PBGA-N96)
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SN74LVCR32245AZKER Details

  • Manufacturer Part Number:

    SN74LVCR32245AZKER

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    LFBGA-96

  • Pin Count:

    96

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Control Type:

    COMMON CONTROL

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PBGA-B96

  • JESD-609 Code:

    e1

  • Length:

    13.5 mm

  • Logic IC Type:

    BUS TRANSCEIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    8

  • Number of Functions:

    4

  • Number of Ports:

    2

  • Number of Terminals:

    96

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE WITH SERIES RESISTOR

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA96,6X16,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.02 mA

  • Prop. Delay@Nom-Sup:

    4.8 ns

  • Propagation Delay (tpd):

    7.8 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.4 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.5 mm

SN74LVCR32245AZKER Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE03, which includes guidelines for signal routing, power supply decoupling, and thermal management.
  • The SN74LVCR32245AZKER has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal via array or a thermal pad on the PCB can be used to improve heat dissipation.
  • The maximum operating frequency of the SN74LVCR32245AZKER is 250 MHz, but it can be limited by the system's signal integrity, PCB layout, and clock distribution network.
  • To ensure signal integrity, use controlled impedance traces, minimize signal routing distances, and use signal termination resistors as recommended in the application note SLVAE03. Additionally, use a clock signal with a rise time of less than 1 ns and a fall time of less than 1 ns.
  • Texas Instruments recommends using a 0.1 μF ceramic capacitor and a 10 μF tantalum capacitor in parallel, placed as close as possible to the power pins of the device.

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SN74LVCR32245AZKER Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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