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SN74LVT8996IPWREP - Texas Instruments

Description: Enhanced Product 3.3-V Abt 10-Bit Multidrop-Addressable Ieee Std 1149.1 Tap Transceiver

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SN74LVT8996IPWREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW0024A
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SN74LVT8996IPWREP - Texas Instruments  - 3D model - Small Outline Packages - PW0024A
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SN74LVT8996IPWREP Details

  • Manufacturer Part Number:

    SN74LVT8996IPWREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-24

  • Pin Count:

    24

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e4

  • Length:

    7.8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR CIRCUIT

SN74LVT8996IPWREP Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in their application note SLVAE03, which includes guidelines for signal routing, power supply decoupling, and thermal management to ensure optimal performance and minimize signal integrity issues.
  • The SN74LVT8996IPWREP has a thermal pad that must be connected to a solid ground plane to dissipate heat. A thermal via array or a thermal pad connected to a heat sink can be used to improve thermal management. Refer to the Texas Instruments application note SLVAE03 for more details.
  • The maximum operating frequency for the SN74LVT8996IPWREP is not explicitly stated in the datasheet. However, based on the device's architecture and similar products, it is recommended to operate the device at a maximum frequency of 100 MHz to ensure reliable operation and minimize signal integrity issues.
  • Yes, the SN74LVT8996IPWREP is compatible with 3.3V systems. The device's input and output voltage levels are compatible with 3.3V logic, and it can operate from a single 3.3V power supply. However, ensure that the input and output voltage levels are within the recommended operating conditions.
  • To troubleshoot issues with the SN74LVT8996IPWREP, start by verifying the power supply voltage, clock signal, and input signal integrity. Use an oscilloscope to monitor the device's output signals and check for any signs of signal degradation or distortion. Refer to the Texas Instruments troubleshooting guide for more detailed guidance.

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SN74LVT8996IPWREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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