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SNJ5430J - Texas Instruments

Description: Military single 8-input, 4.5-V to 5.5-V bipolar NAND gate

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SNJ5430J - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - J0014A_2022
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3D Models
SNJ5430J - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - J0014A_2022
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SNJ5430J Details

  • Manufacturer Part Number:

    SNJ5430J

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Family:

    TTL/H/L

  • JESD-30 Code:

    R-GDIP-T14

  • JESD-609 Code:

    e0

  • Length:

    19.56 mm

  • Load Capacitance (CL):

    15 pF

  • Logic IC Type:

    NAND GATE

  • Max I(ol):

    0.016 A

  • Number of Functions:

    1

  • Number of Inputs:

    8

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP14,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power Supply Current-Max (ICC):

    6 mA

  • Prop. Delay@Nom-Sup:

    22 ns

  • Propagation Delay (tpd):

    22 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Screening Level:

    MIL-PRF-38535

  • Seated Height-Max:

    5.08 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    TTL

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

SNJ5430J Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good layout practices, such as keeping the input and output traces short, using a solid ground plane, and minimizing noise coupling. Additionally, consider using a 4-layer PCB with a dedicated power plane and a separate ground plane.
  • To ensure stable operation, it's crucial to follow the recommended operating conditions, including voltage and current ratings. Additionally, consider using thermal management techniques, such as heat sinks or thermal pads, to maintain a stable junction temperature. It's also essential to characterize the device's performance over the entire operating temperature range during the design and testing phase.
  • The internal ESD protection of the SNJ5430J is designed to protect the device from electrostatic discharge events. However, it's not a substitute for external ESD protection measures. To improve ESD protection, consider adding external ESD protection devices, such as TVS diodes or ESD arrays, and following good PCB design practices, such as using a ground plane and minimizing trace lengths.
  • To optimize power consumption and reduce heat generation, consider using the device's low-power modes, such as the shutdown mode, and optimizing the system's power management strategy. Additionally, ensure that the device is operated within its recommended operating conditions, and consider using thermal management techniques, such as heat sinks or thermal pads, to reduce junction temperature.
  • Potential sources of noise in the SNJ5430J include switching noise, thermal noise, and electromagnetic interference (EMI). To mitigate these sources of noise, consider using noise-reducing techniques, such as filtering, shielding, and grounding. Additionally, ensure that the device is operated within its recommended operating conditions, and consider using noise-reducing components, such as ferrite beads or common-mode chokes.

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SNJ5430J Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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