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SP1103C-01UTG - LITTELFUSE

Description: ESD Suppressors / TVS Diodes 80A 130pF AEC-Q101 TVS DIODES

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Symbol
SP1103C-01UTG - LITTELFUSE - PCB symbol
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PCB Footprints
SP1103C-01UTG - LITTELFUSE PCB footprint - Other - Other - 1.6x1.0mm DFN_2023
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3D Models
SP1103C-01UTG - LITTELFUSE - 3D model - Other - 1.6x1.0mm DFN_2023
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SP1103C-01UTG Details

  • Manufacturer Part Number:

    SP1103C-01UTG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Breakdown Voltage-Max:

    5 V

  • Breakdown Voltage-Min:

    3.4 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • Non-rep Peak Rev Power Dis-Max:

    720 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

SP1103C-01UTG Frequently Asked Questions (FAQs)

  • A good PCB layout for the SP1103C-01UTG involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 10nF capacitor between the VIN and GND pins to filter out noise.
  • To ensure proper thermal management, it's recommended to provide a thermal pad on the PCB, use a heat sink if possible, and keep the device away from other heat sources. The device's thermal pad should be connected to a solid ground plane to dissipate heat efficiently.
  • The maximum allowed voltage drop across the SP1103C-01UTG is 1.5V. Exceeding this voltage drop may affect the device's performance and reliability.
  • The SP1103C-01UTG is rated for operation up to 125°C. However, it's recommended to derate the device's performance at higher temperatures to ensure reliability. Consult the datasheet for specific derating guidelines.
  • To troubleshoot issues with the SP1103C-01UTG, start by verifying the input voltage, checking for proper PCB layout and thermal management, and ensuring the device is properly soldered. Use an oscilloscope to monitor the output voltage and current. Consult the datasheet and application notes for more detailed troubleshooting guidance.

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SP1103C-01UTG Overview

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