Please enter a minimum 3 letters or numbers
Technical Content
Part Image

SP1124-01UTG - LITTELFUSE

Description: ESD Protection Diodes / TVS Diodes 30KV 24V 20A TVS Diod uDFN-2

Download SP1124-01UTG Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
SP1124-01UTG - LITTELFUSE - PCB symbol
click to zoom
PCB Footprints
SP1124-01UTG - LITTELFUSE PCB footprint - Other - Other - SP1124-01UTG-2
click to zoom
3D Models
SP1124-01UTG - LITTELFUSE - 3D model - Other - SP1124-01UTG-2
click to zoom

SP1124-01UTG Details

  • Manufacturer Part Number:

    SP1124-01UTG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    7.06

  • Breakdown Voltage-Min:

    26.7 V

  • Clamping Voltage-Max:

    44.7 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-4

  • Rep Pk Reverse Voltage-Max:

    24 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    24 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

SP1124-01UTG Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SP1124-01UTG is a 0402 package with a land pattern of 0.5mm x 0.3mm. It's essential to follow the recommended footprint to ensure proper soldering and thermal performance.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and place the component on the PCB. Use a reflow oven or a hot air gun to solder the component. Avoid overheating or using excessive force, which can damage the component.
  • The maximum operating temperature for the SP1124-01UTG is 125°C. Exceeding this temperature can affect the component's performance and lifespan.
  • Yes, the SP1124-01UTG is designed to withstand high-vibration environments. However, it's essential to ensure the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent damage or dislodging.
  • To prevent electrostatic discharge (ESD) damage, handle the SP1124-01UTG with an ESD wrist strap or mat. Ensure the workspace is ESD-protected, and avoid touching the component's pins or leads.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

SP1124-01UTG Overview

Use the download button to access the SP1124-01UTG schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SP112, or try a keyword search, such as Transient Suppressors

Parts related to SP1124-01UTG

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑