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SP202EEN-L - MaxLinear, Inc.

Description: 2/2 Transceiver Full RS232 16-SOIC

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PCB Footprints
SP202EEN-L - MaxLinear, Inc. PCB footprint - Small Outline Packages - Small Outline Packages - 16-Pin SOIC_2024
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3D Models
SP202EEN-L - MaxLinear, Inc.  - 3D model - Small Outline Packages - 16-Pin SOIC_2024
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SP202EEN-L Details

  • Manufacturer Part Number:

    SP202EEN-L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, MS-012AC, SOIC-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    5 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    6.72

  • Differential Output:

    NO

  • Driver Number of Bits:

    2

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232-D; V.28

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    1000 ns

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    3000 ns

  • Width:

    3.9 mm

SP202EEN-L Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and radiation.
  • Use a heat sink or thermal pad to dissipate heat. Ensure good airflow around the device. Consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The recommended input impedance is 50 ohms. This ensures maximum power transfer and minimizes signal reflections.
  • Yes, the SP202EEN-L can be used in a push-pull configuration. However, ensure that the output stages are properly biased and matched to avoid oscillations and distortion.
  • Check the PCB layout for signal integrity issues, ensure proper power supply decoupling, and verify that the device is operated within its recommended operating conditions. Use a spectrum analyzer or oscilloscope to identify and debug issues.

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SP202EEN-L Overview

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