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SP3071EEN-L/TR - MaxLinear, Inc.

Description: RS-422/RS-485 Interface IC RS485/RS422 250 KBPS -40C to 85C

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SP3071EEN-L/TR - MaxLinear, Inc. - PCB symbol
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SP3071EEN-L/TR - MaxLinear, Inc. PCB footprint - Small Outline Packages - Small Outline Packages - NSOIC8
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SP3071EEN-L/TR - MaxLinear, Inc. - 3D model - Small Outline Packages - NSOIC8
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SP3071EEN-L/TR Details

  • Manufacturer Part Number:

    SP3071EEN-L/TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    7.2

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485; TIA-485

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    200 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    1500 ns

  • Width:

    3.9 mm

SP3071EEN-L/TR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a common mode filter and a ferrite bead to reduce EMI.
  • Use a low-ESR capacitor (e.g., 10uF) for power decoupling, and place it as close to the device as possible. Ensure the power supply is clean and regulated, and use a ferrite bead or a pi-filter to reduce noise.
  • Use a single-ended clock source with a frequency of 25MHz or 50MHz. Ensure the clock signal is clean and has a low jitter. Use a clock buffer or a clock generator with a low phase noise to minimize jitter.
  • Use the power-down mode when the device is not in use. Reduce the clock frequency to the minimum required for the application. Use a low-power mode for the analog-to-digital converter (ADC) and the digital-to-analog converter (DAC).
  • Keep the analog and digital signals separate and use a separate ground plane for each. Use a shielded cable or a twisted pair for the analog signals, and keep them away from the digital signals.

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SP3071EEN-L/TR Overview

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