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SP3077EEN-L - MaxLinear, Inc.

Description: RS-422/RS-485 Interface IC RS485/RS422 Driver/ Receiver Transceiver

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SP3077EEN-L - MaxLinear, Inc. - PCB symbol
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SP3077EEN-L - MaxLinear, Inc. PCB footprint - Small Outline Packages - Small Outline Packages - SP3077EEN-L
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SP3077EEN-L - MaxLinear, Inc. - 3D model - Small Outline Packages - SP3077EEN-L
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SP3077EEN-L Details

  • Manufacturer Part Number:

    SP3077EEN-L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    7.2

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485; TIA-485

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    75 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    50 ns

  • Width:

    3.9 mm

SP3077EEN-L Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for heat dissipation. A thermal pad on the bottom of the device should be connected to a solid ground plane or a thermal relief pattern.
  • Use a pi-network or a T-network topology for input impedance matching. The optimal component values can be determined using simulation tools like Genesys or ADS. A nominal input impedance of 50 ohms is recommended.
  • Power up the device in the following sequence: VCC, VDD, and then enable the input signal. The recommended supply voltage ramp-up time is 1ms to 10ms to prevent latch-up and ensure reliable operation.
  • Use a shielded enclosure, keep the device away from noise sources, and ensure a solid ground plane on the PCB. Implement EMI filters on the input and output lines, and consider using a common-mode choke for added protection.
  • The recommended operating temperature range is -40°C to 85°C. Store the device in a dry, dark place at temperatures between -40°C and 30°C, and relative humidity below 60%.

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SP3077EEN-L Overview

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