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SP3222ECA-L - EXAR

Description: True +3.0V to +5.5V RS-232 Transceivers

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PCB Footprints
SP3222ECA-L - EXAR PCB footprint - Small Outline Packages - Small Outline Packages - 20 PIN SSOP PACKAGE OUTLINE
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3D Models
SP3222ECA-L - EXAR  - 3D model - Small Outline Packages - 20 PIN SSOP PACKAGE OUTLINE
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SP3222ECA-L Details

  • Manufacturer Part Number:

    SP3222ECA-L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    LEAD FREE, PLASTIC, SSOP-20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Exar Corporation

  • Differential Output:

    NO

  • Driver Number of Bits:

    2

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; EIA-232-D; EIA-232-F; V.24; V.28; EIA-562; TIA-232; TIA-232-F; TIA-562

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    7.2 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    10 V

  • Output Low Current-Max:

    0.0016 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP20,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    5.3 mm

SP3222ECA-L Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the SP3222ECA-L involves keeping the device away from high-frequency noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended. Additionally, the device should be placed near the connector to minimize the length of the transmission lines.
  • To ensure reliable operation of the SP3222ECA-L in high-temperature environments, it is essential to follow proper thermal management practices. This includes providing adequate heat sinking, using a thermally conductive PCB material, and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range, and the junction temperature should be monitored to prevent overheating.
  • The SP3222ECA-L has built-in ESD protection, but it is still essential to follow proper ESD handling and protection procedures during manufacturing, testing, and assembly. This includes using ESD-safe materials, grounding personnel and equipment, and using ESD-protective packaging and storage.
  • To troubleshoot issues with the SP3222ECA-L, start by reviewing the device's datasheet and application notes to ensure that the device is being used within its specified operating conditions. Next, use a logic analyzer or oscilloscope to monitor the device's signals and identify any anomalies. Check for proper power supply, clock signal, and data transmission. If the issue persists, contact Exar Corporation's technical support for further assistance.
  • When using the SP3222ECA-L in a system with multiple transceivers, it is essential to ensure that each transceiver has its own dedicated clock signal and that the clock signals are not shared between transceivers. Additionally, the system should be designed to minimize electromagnetic interference (EMI) and radio-frequency interference (RFI) between the transceivers. Proper signal isolation and shielding should be implemented to prevent signal degradation and ensure reliable operation.

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SP3222ECA-L Overview

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