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SP706SEN-L/TR - MaxLinear, Inc.

Description: Supervisory Circuits LOW PWR MICROPROCESSOR

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PCB Footprints
SP706SEN-L/TR - MaxLinear, Inc. PCB footprint - Small Outline Packages - Small Outline Packages - NSOIC8
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3D Models
SP706SEN-L/TR - MaxLinear, Inc.  - 3D model - Small Outline Packages - NSOIC8
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SP706SEN-L/TR Details

  • Manufacturer Part Number:

    SP706SEN-L/TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    7

  • Additional Feature:

    BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.748 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.93V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3.895 mm

SP706SEN-L/TR Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device near the signal sources. For thermal management, ensure good airflow, use a heat sink if necessary, and follow the recommended thermal pad connection.
  • To optimize for low power consumption, use the device's power-down modes, reduce the clock frequency, minimize the output load, and use the internal voltage regulator. Additionally, consider using a low-dropout regulator and optimizing the system's power management.
  • The SP706SEN-L/TR has built-in ESD protection diodes on all pins. To prevent latch-up, ensure that the device is powered up and down slowly, avoid over-voltage conditions, and use a bypass capacitor on the power supply lines.
  • Use a logic analyzer or oscilloscope to monitor the device's signals, check the power supply and clock signals, and verify the device's configuration and programming. Consult the datasheet and application notes for specific troubleshooting guidelines.
  • Perform functional testing, including signal integrity and power consumption tests. Validate the device's performance using the recommended test circuits and procedures outlined in the datasheet and application notes.

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