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SP708SEN-L/TR - MaxLinear, Inc.

Description: Supervisory Circuits LOW PWR MICROPROCESSOR

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PCB Footprints
SP708SEN-L/TR - MaxLinear, Inc. PCB footprint - Small Outline Packages - Small Outline Packages - NSOIC80
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3D Models
SP708SEN-L/TR - MaxLinear, Inc.  - 3D model - Small Outline Packages - NSOIC80
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SP708SEN-L/TR Details

  • Manufacturer Part Number:

    SP708SEN-L/TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    7

  • Additional Feature:

    BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.748 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.93V

  • Width:

    3.895 mm

SP708SEN-L/TR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a thermal pad connected to a heat sink is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Use a pi-network or a T-network topology for input impedance matching. The optimal component values can be determined using simulation tools like ADS or Genesys.
  • The recommended operating voltage is 5V ±10% with a maximum current of 200mA. Ensure a stable power supply with minimal ripple and noise.
  • Use a logic analyzer or an oscilloscope to monitor the device's signals. Check the datasheet for troubleshooting guidelines and consult the application notes for common issues and solutions.
  • Yes, handle the device with an anti-static wrist strap or mat. Ensure the PCB is designed with ESD protection in mind, and follow the recommended storage and handling procedures.

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SP708SEN-L/TR Overview

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