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SP8K22FRATB - ROHM Semiconductor

Description: MOSFET Nch+Nch 45V Vds 4.5A 0.046Rds(on) 6.8Qg

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SP8K22FRATB - ROHM Semiconductor - PCB symbol
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PCB Footprints
SP8K22FRATB - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - SOP8_ 2021
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3D Models
SP8K22FRATB - ROHM Semiconductor - 3D model - Small Outline Packages - SOP8_ 2021
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SP8K22FRATB Details

  • Manufacturer Part Number:

    SP8K22FRATB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    45 V

  • Drain Current-Max (ID):

    4.5 A

  • Drain-source On Resistance-Max:

    0.064 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    18 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Copper (Sn/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SP8K22FRATB Frequently Asked Questions (FAQs)

  • ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and implement thermal management techniques such as thermal interface materials and airflow management.
  • Handle the device by the body, avoiding touching the pins or leads. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and follow ESD precautions during handling and assembly.
  • Yes, the SP8K22FRATB is designed to withstand vibrations up to 10G (10-2000Hz). However, it's essential to follow proper mounting and soldering techniques to ensure reliable operation in high-vibration environments.
  • ROHM recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.

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SP8K22FRATB Overview

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