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SP8K22HZGTB - ROHM Semiconductor

Description: 45V Dual Nch+Nch Power MOSFET

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SP8K22HZGTB - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - 8 lead sop
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SP8K22HZGTB - ROHM Semiconductor  - 3D model - Small Outline Packages - 8 lead sop
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SP8K22HZGTB Details

  • Manufacturer Part Number:

    SP8K22HZGTB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2019-10-28

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5.4

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    45 V

  • Drain Current-Max (ID):

    4.5 A

  • Drain-source On Resistance-Max:

    0.064 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    70 pF

  • JESD-30 Code:

    R-PDSO-G8

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2 W

  • Pulsed Drain Current-Max (IDM):

    18 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SP8K22HZGTB Frequently Asked Questions (FAQs)

  • ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and implement thermal management techniques such as thermal interface materials and airflow management.
  • Although the datasheet doesn't specify a maximum allowed voltage, it's generally recommended to limit the input voltage to 5.5V to prevent damage to the internal ESD protection diodes.
  • Yes, the SP8K22HZGTB can be used in switching regulator applications, but it's essential to ensure that the device is operated within its recommended operating conditions, and proper layout and decoupling techniques are used to minimize noise and EMI.
  • To prevent latch-up or damage, it's recommended to follow a controlled power-up sequence, ensuring that the input voltage rises slowly (typically 10ms or more) and that the enable pin is held low during power-up.

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SP8K22HZGTB Overview

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