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SP8K33HZGTB - ROHM Semiconductor

Description: 60V Dual Nch+Nch Power MOSFET

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SP8K33HZGTB - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - 8 lead sop
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SP8K33HZGTB - ROHM Semiconductor  - 3D model - Small Outline Packages - 8 lead sop
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SP8K33HZGTB Details

  • Manufacturer Part Number:

    SP8K33HZGTB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2019-10-28

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5.4

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    5 A

  • Drain-source On Resistance-Max:

    0.056 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    70 pF

  • JESD-30 Code:

    R-PDSO-G8

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2 W

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SP8K33HZGTB Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure stable operation with a high-impedance input source, add a 1kΩ to 10kΩ resistor in series with the input pin to reduce the input impedance. Additionally, consider adding a 10nF to 100nF capacitor in parallel with the input pin to filter out high-frequency noise.
  • Although the datasheet doesn't specify a maximum voltage for the enable pin (EN), it's recommended to keep it within the VCC range (i.e., 3.3V or 5V) to ensure proper operation and prevent damage to the device.
  • While the SP8K33HZGTB is rated for operation up to 125°C, it's essential to consider the package's thermal resistance and the PCB's thermal design to ensure reliable operation. ROHM recommends derating the device's power consumption and voltage rating at high temperatures to prevent overheating and ensure long-term reliability.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output load, and PCB layout for any signs of noise or oscillation. Verify that the output capacitor is properly sized and placed close to the device. If issues persist, consider using an oscilloscope to analyze the output voltage waveform and identify any anomalies.

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SP8K33HZGTB Overview

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