SP8M24HZGTB footprint, schematic symbol and 3D model by ROHM Semiconductor

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Part Number SP8M24HZGTB
Manufacturer ROHM Semiconductor
Pin Count 8
Part Category MOSFET (N-Channel)
Package Category Small Outline Packages
Footprint Name Small Outline Packages - 8 lead sop
Released Date Sep 16, 2022
Last Modified Date Apr 22, 2025 2:34 PM UTC
Pinout / Pin List Click Here (Member Only)

SP8M24HZGTB Details

Manufacturer Part Number:
SP8M24HZGTB
Rohs Code:
Yes
Part Life Cycle Code:
Active
ECCN Code:
EAR99
Date Of Intro:
2019-09-09
Manufacturer:
ROHM Semiconductor
YTEOL:
5.4
Configuration:
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
45 V
Drain Current-Max (ID):
4.5 A
Drain-source On Resistance-Max:
0.064 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
70 pF
JESD-30 Code:
R-PDSO-G8
Moisture Sensitivity Level:
1
Number of Elements:
2
Number of Terminals:
8
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL AND P-CHANNEL
Power Dissipation-Max (Abs):
2 W
Pulsed Drain Current-Max (IDM):
18 A
Reference Standard:
AEC-Q101
Surface Mount:
YES
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON

SP8M24HZGTB Frequently Asked Questions (FAQs)

ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including derating the power dissipation according to the temperature. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature.
ROHM recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
While the SP8M24HZGTB is not specifically designed for high-humidity environments, it can still be used with proper precautions. Ensure the device is properly sealed, and consider applying a conformal coating to protect against moisture ingress.
ROHM recommends storing the SP8M24HZGTB in a dry, cool place with a temperature range of 5°C to 30°C (41°F to 86°F) and a relative humidity of 60% or less. Avoid storing the device in direct sunlight or near heat sources.

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SP8M24HZGTB Overview

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SP8M24HZGTB - ROHM Semiconductor

SP8M24HZGTB Details

SP8M24HZGTB Frequently Asked Questions (FAQs)

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