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- Part Number SP8M3HZGTB
- Manufacturer ROHM Semiconductor
- Pin Count 8
- Part Category Integrated Circuit
- Package Category Small Outline Packages
- Footprint Name Small Outline Packages - 8 lead sop
- Released Date Sep 16, 2022
- Last Modified Date Apr 22, 2025 2:34 PM UTC
- Pinout / Pin List Click Here (Member Only)
SP8M3HZGTB Details
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Manufacturer Part Number:
SP8M3HZGTB
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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Date Of Intro:
2019-12-06
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Manufacturer:
ROHM Semiconductor
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YTEOL:
5.32
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Configuration:
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
30 V
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Drain Current-Max (ID):
5 A
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Drain-source On Resistance-Max:
0.082 Ω
SP8M3HZGTB Frequently Asked Questions (FAQs)
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ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink or thermal management system to keep the device temperature within the recommended range.
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ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s. It's essential to follow the recommended soldering profile to prevent damage to the device.
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To prevent damage during storage and shipping, it's essential to follow proper handling and storage procedures. Store the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures. Avoid bending, flexing, or applying excessive pressure to the leads.
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To prevent electrostatic discharge (ESD) damage, it's essential to follow proper handling and storage procedures. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. Avoid touching the device's pins or leads, and use ESD-safe packaging materials.
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SP8M3HZGTB Overview
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