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SPC5514GBMLQ66 - NXP

Description: LQFP144, plastic, low profile quad flat package; 144 terminals; 0.5 mm pitch; 20 mm x 20 mm x 1.4 mm body.

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Symbol
SPC5514GBMLQ66 - NXP - PCB symbol
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PCB Footprints
SPC5514GBMLQ66 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT486-2
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3D Models
SPC5514GBMLQ66 - NXP - 3D model - Quad Flat Packages - SOT486-2
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SPC5514GBMLQ66 Details

  • Manufacturer Part Number:

    SPC5514GBMLQ66

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bit Size:

    32

  • CPU Family:

    E200

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    32768

  • ROM (words):

    131072

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Speed:

    66 MHz

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

SPC5514GBMLQ66 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in the SPC5514GBMLQ66 application note (AN12345). It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • The SPC5514GBMLQ66 has multiple low-power modes, including sleep, standby, and shutdown. Refer to the device's user manual (UM10544) for detailed instructions on configuring these modes using the Power Management Controller (PMC).
  • When designing a power supply for SPC5514GBMLQ66, consider the device's power consumption, voltage tolerance, and noise sensitivity. Ensure the power supply can provide a stable voltage within the recommended range (1.2V to 1.35V) and has adequate decoupling capacitors to filter out noise.
  • Optimizing the SPC5514GBMLQ66's performance requires understanding the device's architecture, instruction pipeline, and memory hierarchy. Refer to the device's user manual (UM10544) and application notes (e.g., AN12346) for guidance on optimizing performance for your specific use case.
  • The SPC5514GBMLQ66 has built-in security features, including a Hardware Security Module (HSM) and secure boot mechanisms. Ensure you follow NXP's guidelines for secure programming and configuration to prevent unauthorized access and protect sensitive data.

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SPC5514GBMLQ66 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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SPC5514GBMLQ66 Alternates

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Part Image SPC5514GBMLQ66 Freescale Semiconductor

Microcontroller, 32-Bit, FLASH, E200 CPU, 66MHz, CMOS, PQFP144