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SPC5607BK0VLU6R - NXP

Description: 32-bit Microcontrollers - MCU NXP 32-bit MCU, Power Arch core, 1.5MB Flash, 64MHz, -40/+105degC, Automotive Grade, QFP 176

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SPC5607BK0VLU6R - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SPC5607BK0VLU6R
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SPC5607BK0VLU6R - NXP  - 3D model - Quad Flat Packages - SPC5607BK0VLU6R
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SPC5607BK0VLU6R Details

  • Manufacturer Part Number:

    SPC5607BK0VLU6R

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-176

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES AT 4.5V TO 5.5V SUPPLY

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    E200Z0H

  • Clock Frequency-Max:

    16 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G176

  • JESD-609 Code:

    e3

  • Length:

    24 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    24

  • Number of I/O Lines:

    149

  • Number of Serial I/Os:

    16

  • Number of Terminals:

    176

  • Number of Timers:

    8

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP176,1.0SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    98304

  • ROM (words):

    1572864

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    64 MHz

  • Supply Current-Max:

    140 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    24 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

SPC5607BK0VLU6R Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide for the SPC5607BK0VLU6R in the 'SPC5607BK0VLU6R PCB Layout Guidelines' document, which can be found on the NXP website. This document provides detailed information on component placement, routing, and thermal management.
  • The clock settings for the SPC5607BK0VLU6R can be configured using the Clock Manager (CLKMGR) module. The CLKMGR module allows you to select the clock source, configure the clock frequency, and enable/disable clock outputs. Refer to the 'SPC5607BK0VLU6R Reference Manual' for more information on clock configuration.
  • The SPC5607BK0VLU6R has an operating temperature range of -40°C to 125°C. However, it's recommended to operate the device within the -40°C to 105°C range for optimal performance and reliability.
  • The SPC5607BK0VLU6R has a built-in Secure Boot mechanism that ensures the authenticity and integrity of the software. To implement secure boot, you need to generate a secure boot key, create a secure boot image, and configure the boot mode. Refer to the 'SPC5607BK0VLU6R Secure Boot Guide' for more information on implementing secure boot.
  • The maximum current consumption of the SPC5607BK0VLU6R depends on the operating frequency, voltage, and peripherals used. According to the datasheet, the maximum current consumption is around 350mA at 1.2V and 264MHz. However, it's recommended to perform power analysis and optimization to minimize current consumption and reduce power dissipation.

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SPC5607BK0VLU6R Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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