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SPC560B50L3B6E0X - STMicroelectronics

Description: 32-bit MCU family built on the Power Architecture® for automotive body electronics applications

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SPC560B50L3B6E0X - STMicroelectronics PCB footprint - Quad Flat Packages - Quad Flat Packages - 3. LQFP100, 14 x 14 mm 100-pin low-profile quad flat package outline
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SPC560B50L3B6E0X - STMicroelectronics  - 3D model - Quad Flat Packages - 3. LQFP100, 14 x 14 mm 100-pin low-profile quad flat package outline
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SPC560B50L3B6E0X Details

  • Manufacturer Part Number:

    SPC560B50L3B6E0X

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100

  • Pin Count:

    100

  • Country Of Origin:

    Malta

  • ECCN Code:

    5A991.B.4.A

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES WITH 5 V NOMINAL SUPPLY

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    16 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    79

  • Number of Terminals:

    100

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    32768

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    64 MHz

  • Supply Current-Max:

    140 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

SPC560B50L3B6E0X Frequently Asked Questions (FAQs)

  • The SPC560B50L3B6E0X can operate from -40°C to 125°C, with a junction temperature range of -40°C to 150°C.
  • The clock settings for the SPC560B50L3B6E0X can be configured using the Clock Generation Unit (CGU) module. The CGU module allows you to select the clock source, configure the clock frequency, and enable or disable clock outputs. You can refer to the device's reference manual for more information on clock configuration.
  • The maximum frequency of the CPU is 64 MHz, and the maximum frequency of the peripherals is 32 MHz.
  • The SPC560B50L3B6E0X has several low-power modes, including Sleep, Stop, and Standby modes. These modes can be implemented using the Power Management Unit (PMU) module. You can refer to the device's reference manual for more information on how to implement low-power modes.
  • The SPC560B50L3B6E0X has 512 KB of flash memory and 64 KB of SRAM.

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SPC560B50L3B6E0X Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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