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SPC560P50L3CEFBY - STMicroelectronics

Description: 32-bit Power Architecture® based MCU with 576 KB Flash memory and 40 KB SRAM for automotive chassis and safety applications

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SPC560P50L3CEFBY - STMicroelectronics PCB footprint - Quad Flat Packages - Quad Flat Packages - . LQFP144 package mechanical drawing-
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SPC560P50L3CEFBY Details

  • Manufacturer Part Number:

    SPC560P50L3CEFBY

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    QFP

  • Package Description:

    LQFP-100

  • Pin Count:

    100

  • Country Of Origin:

    Malta

  • ECCN Code:

    5A991.B.4.A

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Address Bus Width:

    32

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    SPC56

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G100

  • Length:

    14 mm

  • Low Power Mode:

    NO

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    25

  • Number of I/O Lines:

    67

  • Number of Terminals:

    100

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100(UNSPEC)

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    40960

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Speed:

    60 MHz

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

SPC560P50L3CEFBY Frequently Asked Questions (FAQs)

  • The SPC560P50L3CEFBY can operate from -40°C to 125°C, with a junction temperature range of -40°C to 150°C.
  • The clock settings for the SPC560P50L3CEFBY can be configured using the Clock Generation Unit (CGU) module, which allows for flexible clock configuration and management. Refer to the device's reference manual for detailed information on clock configuration.
  • The maximum frequency of the CPU is 64 MHz, while the peripherals can operate at a maximum frequency of 32 MHz.
  • The SPC560P50L3CEFBY has 512 KB of flash memory and 64 KB of SRAM.
  • The SPC560P50L3CEFBY has a range of communication interfaces, including 2x CAN, 2x LIN, 2x SPI, 2x I2C, 1x UART, and 1x FlexRay interface.

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SPC560P50L3CEFBY Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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