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SPC5633MF2MLQ60R - NXP

Description: 32-bit Microcontrollers - MCU NXP 32-bit MCU, Power Arch core, 1MB Flash, 60MHz, -40/+125degC, Automotive Grade, QFP 144

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SPC5633MF2MLQ60R - NXP - PCB symbol
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PCB Footprints
SPC5633MF2MLQ60R - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT486-2
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SPC5633MF2MLQ60R - NXP - 3D model - Quad Flat Packages - SOT486-2
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SPC5633MF2MLQ60R Details

  • Manufacturer Part Number:

    SPC5633MF2MLQ60R

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-144

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    39 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

SPC5633MF2MLQ60R Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide in the SPC5633MF2MLQ60R application note (AN4753) which includes guidelines for component placement, routing, and thermal management.
  • To optimize power consumption, use the low-power modes (e.g., sleep, standby) when the device is not actively processing data. Additionally, adjust the clock frequency, voltage, and peripheral usage to minimize power consumption. Refer to the SPC5633MF2MLQ60R datasheet and application notes for more information.
  • The SPC5633MF2MLQ60R has an operating temperature range of -40°C to 125°C (junction temperature). However, the device can be operated at a lower temperature range (e.g., -40°C to 105°C) for improved reliability and performance.
  • To ensure EMC, follow the guidelines in the SPC5633MF2MLQ60R application note (AN4753) for PCB layout, component selection, and shielding. Additionally, use electromagnetic interference (EMI) filters and shielding on the device's I/O lines, and ensure that the device is properly grounded.
  • NXP recommends using decoupling capacitors with a value of 100 nF to 1 μF, and a voltage rating of 1.8 V to 3.3 V, depending on the specific application and power supply requirements. Refer to the SPC5633MF2MLQ60R datasheet and application notes for more information.

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SPC5633MF2MLQ60R Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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