SPC5643LFF2MMM1 - NXP

SPC5643LFF2MMM1 Details

• Manufacturer Part Number:

  SPC5643LFF2MMM1

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  MABGA-257

• Country Of Origin:

  Mainland China, Malaysia

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  12 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  5

• JESD-30 Code:

  S-PBGA-B257

• Length:

  14 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  257

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA257,17X17,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.51 mm

• Supply Voltage-Max:

  3.63 V

• Supply Voltage-Min:

  3 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Nickel/Gold (Ni/Au)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  14 mm

• uPs/uCs/Peripheral ICs Type:

  SoC