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SPC5646CCF0VLU1 - NXP

Description: MCU 32-bit e200z4d/e200z0h RISC 3MB Flash 3.3V/5V Automotive 176-Pin LQFP Tray

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SPC5646CCF0VLU1 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - 176 LQFP
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SPC5646CCF0VLU1 - NXP  - 3D model - Quad Flat Packages - 176 LQFP
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SPC5646CCF0VLU1 Details

  • Manufacturer Part Number:

    SPC5646CCF0VLU1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-176

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES WITH 3.3 V NOMINAL SUPPLY

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    E200Z4D

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G176

  • JESD-609 Code:

    e3

  • Length:

    24 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    32

  • Number of External Interrupts:

    32

  • Number of I/O Lines:

    147

  • Number of Serial I/Os:

    16

  • Number of Terminals:

    176

  • Number of Timers:

    9

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP176,1.0SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    262144

  • ROM (words):

    3145728

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    120 MHz

  • Supply Current-Max:

    300 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    24 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

SPC5646CCF0VLU1 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide for the SPC5646CCF0VLU1 in the 'SPC5646CCF0VLU1 PCB Layout Guidelines' document, which can be found on the NXP website. It's essential to follow this guide to ensure proper signal integrity, power supply, and thermal management.
  • To configure the SPC5646CCF0VLU1 for low power consumption, you can use the device's power management features, such as dynamic voltage and frequency scaling, clock gating, and power gating. Additionally, you can optimize your software to minimize power consumption by using low-power modes, reducing CPU frequency, and turning off peripherals when not in use.
  • The SPC5646CCF0VLU1 has an operating temperature range of -40°C to 125°C, as specified in the datasheet. However, it's essential to ensure proper thermal management, such as heat sinking and airflow, to prevent overheating and ensure reliable operation.
  • Yes, the SPC5646CCF0VLU1 is AEC-Q100 qualified, making it suitable for automotive applications. However, it's essential to ensure that your design meets the specific requirements of the automotive industry, such as functional safety, electromagnetic compatibility, and environmental testing.
  • NXP provides a range of debugging and troubleshooting tools for the SPC5646CCF0VLU1, including the SPC5-Studio development environment, the SPC5-Link debugger, and the SPC5-Flash programmer. Additionally, you can use third-party tools, such as logic analyzers and oscilloscopes, to debug and troubleshoot issues.

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SPC5646CCF0VLU1 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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