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SPC5674FAMVR3 - NXP

Description: 32-bit Microcontrollers - MCU NXP 32-bit MCU, Power Arch core, 4MB Flash, 264MHz, -40/+125degC, Automotive Grade, PBGA 416

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Symbol
SPC5674FAMVR3 - NXP - PCB symbol
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PCB Footprints
SPC5674FAMVR3 - NXP PCB footprint - BGA - BGA - SOT1705-1
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3D Models
SPC5674FAMVR3 - NXP - 3D model - BGA - SOT1705-1
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SPC5674FAMVR3 Details

  • Manufacturer Part Number:

    SPC5674FAMVR3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TEBGA-416

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    32

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PBGA-B416

  • JESD-609 Code:

    e2

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    416

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    262144

  • ROM (words):

    4194304

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    2.55 mm

  • Speed:

    264 MHz

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    27 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

SPC5674FAMVR3 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for SPC5674FAMVR3 is -40°C to 125°C, with a junction temperature of up to 150°C.
  • The clock settings for the SPC5674FAMVR3 can be configured using the Clock Generation Module (CGM) and the Power Management Controller (PMC). The CGM generates the clock signals for the processor and peripherals, while the PMC controls the power modes and clock gating. Refer to the device's reference manual for detailed configuration information.
  • The maximum frequency of the SPC5674FAMVR3 is 264 MHz, with a maximum bus frequency of 132 MHz.
  • The SPC5674FAMVR3 supports secure boot through the use of a Boot Assist Module (BAM) and a Secure Boot Controller (SBC). The BAM verifies the authenticity of the boot code, while the SBC manages the secure boot process. Refer to the device's reference manual and the NXP secure boot documentation for detailed implementation information.
  • The power consumption characteristics of the SPC5674FAMVR3 vary depending on the operating frequency, voltage, and power mode. In active mode, the device consumes around 1.2W at 264 MHz and 1.2V. In sleep mode, the device consumes around 10mW. Refer to the device's datasheet for detailed power consumption information.

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SPC5674FAMVR3 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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