SPC5674FF3MVV3 - NXP

SPC5674FF3MVV3 Details

• Manufacturer Part Number:

  SPC5674FF3MVV3

• Part Life Cycle Code:

  Active

• Country Of Origin:

  Malaysia

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  12 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  5

• Has ADC:

  YES

• Bit Size:

  32

• Boundary Scan:

  YES

• CPU Family:

  E200

• Clock Frequency-Max:

  40 MHz

• DAC Channels:

  NO

• DMA Channels:

  YES

• JESD-30 Code:

  S-PBGA-B516

• JESD-609 Code:

  e0

• Length:

  27 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  516

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA516,26X26,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  245

• Qualification Status:

  Not Qualified

• RAM (bytes):

  262144

• ROM (words):

  4194304

• ROM Programmability:

  FLASH

• Screening Level:

  AEC-Q100

• Speed:

  264 MHz

• Supply Current-Max:

  1000 mA

• Supply Voltage-Max:

  1.32 V

• Supply Voltage-Min:

  1.14 V

• Supply Voltage-Nom:

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin/Lead (Sn63Pb37)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  27 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC