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SPC570S50E1CEFAR - STMicroelectronics

Description: 32-bit Microcontrollers - MCU 32-bit Power Architecture MCU for Automotive Chassis and Safety Applications

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SPC570S50E1CEFAR - STMicroelectronics PCB footprint - Quad Flat Packages - Quad Flat Packages - TQFP64 (10x10x1 mm exp. pad down)--0
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SPC570S50E1CEFAR - STMicroelectronics  - 3D model - Quad Flat Packages - TQFP64 (10x10x1 mm exp. pad down)--0
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SPC570S50E1CEFAR Details

  • Manufacturer Part Number:

    SPC570S50E1CEFAR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Manufacturer Package Code:

    TQFP 64 10x10x1.0

  • Country Of Origin:

    Malta

  • ECCN Code:

    5A991.B.4.A

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    30 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    32

  • Clock Frequency-Max:

    40 MHz

  • DMA Channels:

    YES

  • JESD-609 Code:

    e4

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    43

  • Number of Terminals:

    64

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • PWM Channels:

    NO

  • Package Code:

    HTFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    49152

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Speed:

    80 MHz

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

SPC570S50E1CEFAR Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the SPC570S50E1CEFAR application note (AN5163) which includes guidelines for power supply, decoupling, and signal routing.
  • Optimizing flash memory programming for the SPC570S50E1CEFAR involves using the STMicroelectronics-provided flash programming tools, such as the SPC5-FLASH, and following the guidelines in the SPC570S50E1CEFAR programming manual.
  • Thermal management for the SPC570S50E1CEFAR involves ensuring proper heat dissipation through the use of heat sinks, thermal interfaces, and PCB design considerations, as outlined in the SPC570S50E1CEFAR thermal design guide.
  • Implementing functional safety in a design using the SPC570S50E1CEFAR involves following the guidelines outlined in the SPC570S50E1CEFAR safety manual, which includes information on fault detection, error correction, and safety-oriented design principles.
  • EMC considerations for the SPC570S50E1CEFAR involve following the guidelines outlined in the SPC570S50E1CEFAR EMC application note, which includes information on PCB design, component selection, and shielding.

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SPC570S50E1CEFAR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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