SPC5746CHK1AMMH6 - NXP

SPC5746CHK1AMMH6 Details

• Manufacturer Part Number:

  SPC5746CHK1AMMH6

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  MAPBGA-100

• Country Of Origin:

  Mainland China, Malaysia

• ECCN Code:

  5A992.C

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  12 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  10

• Has ADC:

  YES

• Bit Size:

  32

• Boundary Scan:

  YES

• CPU Family:

  E200Z4

• Clock Frequency-Max:

  40 MHz

• DAC Channels:

  NO

• DMA Channels:

  YES

• Format:

  FLOATING POINT

• Integrated Cache:

  YES

• JESD-30 Code:

  S-PBGA-B100

• JESD-609 Code:

  e2

• Length:

  11 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of DMA Channels:

  32

• Number of External Interrupts:

  1

• Number of I/O Lines:

  65

• Number of Terminals:

  100

• Number of Timers:

  64

• On Chip Data RAM Width:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  NO

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LBGA

• Package Equivalence Code:

  BGA100,10X10,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE

• Peak Reflow Temperature (Cel):

  260

• RAM (bytes):

  393216

• ROM (words):

  3145728

• ROM Programmability:

  FLASH

• Screening Level:

  ISO 26262

• Seated Height-Max:

  1.41 mm

• Speed:

  160 MHz

• Supply Current-Max:

  264 mA

• Supply Voltage-Max:

  1.32 V

• Supply Voltage-Min:

  1.2 V

• Supply Voltage-Nom:

  1.25 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Silver (Sn/Ag)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  11 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC