Please enter a minimum 3 letters or numbers
Technical Content
Part Image

SPC5777CCK3MME3R - NXP

Description: e200z7 MPC57xx Microcontroller IC 32-Bit Tri-Core 264MHz 8MB (8M x 8) FLASH 416-MAPBGA (27x27)

Download SPC5777CCK3MME3R Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
SPC5777CCK3MME3R - NXP - PCB symbol
click to zoom
PCB Footprints
SPC5777CCK3MME3R - NXP PCB footprint - BGA - BGA - SOT1528-1_2025
click to zoom
3D Models
SPC5777CCK3MME3R - NXP - 3D model - BGA - SOT1528-1_2025
click to zoom

SPC5777CCK3MME3R Details

  • Manufacturer Part Number:

    SPC5777CCK3MME3R

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MAPBGA-416

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2016-03-08

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8.08

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PBGA-B416

  • JESD-609 Code:

    e2

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    416

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    524288

  • ROM (words):

    8388608

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.02 mm

  • Speed:

    264 MHz

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    27 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

SPC5777CCK3MME3R Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in the SPC5777CCK3MME3R application note (AN12247). It includes guidelines for thermal pad design, heat sink attachment, and PCB layer stackup to ensure optimal thermal performance.
  • The SPC5777CCK3MME3R has multiple low-power modes, including sleep, stop, and standby modes. To configure low-power mode, refer to the device's reference manual (RM0444) and follow the instructions for setting the Power Management Controller (PMC) registers and configuring the clock domains.
  • The SPC5777CCK3MME3R has an operating temperature range of -40°C to 125°C (junction temperature). However, the device can be operated at a lower temperature range depending on the specific application and use case.
  • The SPC5777CCK3MME3R has built-in safety and security features, including error correction code (ECC) memory, memory protection units (MPUs), and a hardware security module (HSM). To implement functional safety and security features, refer to the device's safety manual (SM032) and follow the guidelines for configuring and using these features.
  • NXP recommends using the S32 Design Studio, a free integrated development environment (IDE) that provides a comprehensive set of tools for developing, debugging, and optimizing applications on the SPC5777CCK3MME3R. Additionally, NXP provides a range of software development kits (SDKs) and example code to help get started with development.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

SPC5777CCK3MME3R Overview

Use the download button to access the SPC5777CCK3MME3R schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SPC57, or try a keyword search, such as Microcontrollers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

Parts related to SPC5777CCK3MME3R

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑

SPC5777CCK3MME3R Alternates

Showing results

Image Part Number Model
Part Image SPC5777CCK3MME3 NXP Semiconductors

RISC Microcontroller, 32-Bit, FLASH, E200Z7 CPU, 264MHz, CMOS, PBGA416