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SPC5777CDK3MMO3 - NXP

Description: NXP - SPC5777CDK3MMO3 - MCU, 32BIT, 264MHZ, MAPBGA-516

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SPC5777CDK3MMO3 - NXP - PCB symbol
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PCB Footprints
SPC5777CDK3MMO3 - NXP PCB footprint - BGA - BGA - 516 TEPBGA -Package
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3D Models
SPC5777CDK3MMO3 - NXP - 3D model - BGA - 516 TEPBGA -Package
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SPC5777CDK3MMO3 Details

  • Manufacturer Part Number:

    SPC5777CDK3MMO3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MAPBGA-516

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PBGA-B516

  • JESD-609 Code:

    e2

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    216

  • Number of Terminals:

    516

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    524288

  • ROM (words):

    8388608

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.02 mm

  • Speed:

    264 MHz

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    27 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

SPC5777CDK3MMO3 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide for the SPC5777CDK3MMO3 in the device's application note (AN12345). It's essential to follow this guide to ensure proper signal integrity, power supply, and thermal management.
  • To optimize power consumption, use the device's low-power modes (e.g., sleep, standby), reduce clock frequencies, and minimize peripheral usage. Additionally, use the power gating feature to turn off unused modules. Refer to the device's datasheet and application notes for more information.
  • The SPC5777CDK3MMO3 has a maximum junction temperature of 150°C. Ensure proper heat dissipation by using a heat sink, thermal interface material, and a well-designed PCB with thermal vias. Follow NXP's thermal management guidelines and application notes for more information.
  • To ensure EMC, follow NXP's guidelines for PCB layout, component selection, and shielding. Use a metal shield can or a Faraday cage to enclose the device, and ensure proper grounding and decoupling. Refer to the device's datasheet and application notes for more information.
  • In automotive applications, ensure the device meets the required automotive standards (e.g., AEC-Q100). Follow NXP's guidelines for automotive applications, including temperature range, voltage supply, and electromagnetic compatibility. Additionally, consider using automotive-qualified components and follow the device's datasheet and application notes.

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SPC5777CDK3MMO3 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image SPC5777CDK3MMO3R NXP Semiconductors

RISC Microcontroller, 32-Bit, FLASH, 264MHz, CMOS, PBGA516