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SQ2325ES-T1_GE3 - Vishay

Description: MOSFET P-Chnl 150-V (D-S) AEC-Q101 Qualified

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PCB Footprints
SQ2325ES-T1_GE3 - Vishay PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236)
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3D Models
SQ2325ES-T1_GE3 - Vishay  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236)
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SQ2325ES-T1_GE3 Details

  • Manufacturer Part Number:

    SQ2325ES-T1_GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOT-23, 3 PIN

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Germany

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    1.12 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    0.84 A

  • Drain-source On Resistance-Max:

    1.77 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    22 pF

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    3 W

  • Pulsed Drain Current-Max (IDM):

    2 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    34 ns

  • Turn-on Time-Max (ton):

    30 ns

SQ2325ES-T1_GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SQ2325ES-T1_GE3 is a rectangular pad with a size of 2.5 mm x 1.25 mm, with a 0.5 mm radius corner and a 0.3 mm spacing between pads.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a solder paste with a melting point of 217°C to 221°C. Also, make sure to follow the recommended soldering profile and avoid overheating the component.
  • The maximum operating temperature range for the SQ2325ES-T1_GE3 is -55°C to 150°C, with a derating of 1.33 mΩ/°C above 25°C.
  • Yes, the SQ2325ES-T1_GE3 is suitable for high-frequency applications up to 1 GHz, but it's essential to consider the component's parasitic inductance and capacitance, as well as the PCB layout and design, to minimize signal degradation and ensure optimal performance.
  • Store the SQ2325ES-T1_GE3 in a dry, cool place, away from direct sunlight and moisture. During shipping, use anti-static packaging materials and avoid exposing the components to mechanical stress or vibration.

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SQ2325ES-T1_GE3 Overview

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