Please enter a minimum 3 letters or numbers
Technical Content
Part Image

SQ3456BEV-T1_GE3 - Vishay

Description: N-Channel MOSFET, 7.8 A, 30 V, 6-Pin TSOP Vishay SQ3456BEV-T1_GE3

Download SQ3456BEV-T1_GE3 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
SQ3456BEV-T1_GE3 - Vishay - PCB symbol
click to zoom
PCB Footprints
SQ3456BEV-T1_GE3 - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - 6-LEAD TSOP
click to zoom
3D Models
SQ3456BEV-T1_GE3 - Vishay - 3D model - Small Outline Packages - 6-LEAD TSOP
click to zoom

SQ3456BEV-T1_GE3 Details

  • Manufacturer Part Number:

    SQ3456BEV-T1_GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, TSOP-6

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    0.0078 A

  • Drain-source On Resistance-Max:

    0.035 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    35 pF

  • JESD-30 Code:

    R-PDSO-G6

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Element Material:

    SILICON

SQ3456BEV-T1_GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SQ3456BEV-T1_GE3 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a 0.3 mm radius corner and a 0.2 mm spacing between pads.
  • To handle thermal management, ensure a good thermal connection to the PCB, use a thermal pad or a heat sink, and consider using a thermal interface material (TIM) to reduce thermal resistance.
  • The maximum operating temperature range for the SQ3456BEV-T1_GE3 is -40°C to 150°C, with a storage temperature range of -40°C to 150°C.
  • To ensure proper soldering, use a soldering iron with a temperature of 260°C to 280°C, and apply a solder paste with a melting point of 217°C to 221°C. Avoid overheating or applying excessive force during soldering.
  • Handle the SQ3456BEV-T1_GE3 by the body, avoiding touching the leads or electrical contacts. Store the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

SQ3456BEV-T1_GE3 Overview

Use the download button to access the SQ3456BEV-T1_GE3 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SQ345, or try a keyword search, such as Power Field-Effect Transistors

Parts related to SQ3456BEV-T1_GE3

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑