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SQD100N03-3M2L-GE3 - Vishay

Description: MOSFET RECOMMENDED ALT 78-SQD100N033M2L_GE3

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SQD100N03-3M2L-GE3 - Vishay PCB footprint - Other - Other - TO-252AA_(h=2.507)
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SQD100N03-3M2L-GE3 Details

  • Manufacturer Part Number:

    SQD100N03-3M2L-GE3

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SMALL OUTLINE, R-PSSO-G2

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    180 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    100 A

  • Drain-source On Resistance-Max:

    0.0032 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    150 A

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

SQD100N03-3M2L-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for SQD100N03-3M2L_GE3 is a TO-220AB package with a minimum pad size of 4.5mm x 4.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure reliable operation of SQD100N03-3M2L_GE3 in high-temperature environments, it is recommended to follow the thermal management guidelines provided in the datasheet, including using a heat sink with a thermal resistance of ≤ 1.5°C/W and ensuring good airflow around the device.
  • The maximum allowed voltage transient for SQD100N03-3M2L_GE3 is ± 50V for a duration of ≤ 50ns, as specified in the datasheet. Exceeding this limit may damage the device.
  • Yes, SQD100N03-3M2L_GE3 can be used in a parallel configuration to increase current handling, but it is essential to ensure that the devices are properly matched and that the current sharing is balanced to avoid overheating and reduce reliability.
  • The recommended gate drive voltage for SQD100N03-3M2L_GE3 is between 10V and 15V, with a rise time of ≤ 10ns and a fall time of ≤ 10ns, to ensure reliable switching and minimize losses.

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SQD100N03-3M2L-GE3 Overview

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