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SQD50N10-8m9L_GE3 - Vishay

Description: MOSFET 100V 50A 45watt AEC-Q101 Qualified

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SQD50N10-8m9L_GE3 - Vishay PCB footprint - Other - Other - TO-252AA_1
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SQD50N10-8m9L_GE3 - Vishay  - 3D model - Other - TO-252AA_1
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SQD50N10-8m9L_GE3 Details

  • Manufacturer Part Number:

    SQD50N10-8M9L_GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3/2

  • Country Of Origin:

    Germany

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    92 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    50 A

  • Drain-source On Resistance-Max:

    0.0089 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    160 pF

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    200 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Pure Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    325 ns

  • Turn-on Time-Max (ton):

    36 ns

SQD50N10-8m9L_GE3 Frequently Asked Questions (FAQs)

  • The thermal resistance of the SQD50N10-8M9L_GE3 is typically around 1.5°C/W, but this can vary depending on the specific application and cooling conditions.
  • Yes, the SQD50N10-8M9L_GE3 is designed for high-reliability applications and is qualified to various industry standards, including AEC-Q101 and IEC 60747-9.
  • The recommended soldering profile for the SQD50N10-8M9L_GE3 is a peak temperature of 260°C for 10-30 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s.
  • Yes, the SQD50N10-8M9L_GE3 is compatible with lead-free soldering processes and is RoHS-compliant.
  • The maximum operating frequency of the SQD50N10-8M9L_GE3 is typically around 100 kHz, but this can vary depending on the specific application and circuit design.

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SQD50N10-8m9L_GE3 Overview

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