SQD50P06-15L_GE3 footprint, schematic symbol and 3D model by Vishay

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PCB Footprints

SQD50P06-15L_GE3 - Vishay PCB footprint - Other - Other - SQD50P06-15L_GE3-1

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Datasheet Download Datasheet
Stock & Prices Price & Stock for SQD50P06-15L_GE3
Part Number SQD50P06-15L_GE3
Manufacturer Vishay
Pin Count 3
Part Category MOSFET (P-Channel)
Package Category Other
Footprint Name Other - SQD50P06-15L_GE3-1
Released Date Oct 5, 2017
Last Modified Date Jun 26, 2026 12:14 PM UTC
Pinout / Pin List Click Here (Member Only)

SQD50P06-15L_GE3 Details

Manufacturer Part Number:
SQD50P06-15L_GE3
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Country Of Origin:
Germany
ECCN Code:
EAR99
Factory Lead Time:
18 Weeks
Manufacturer:
Vishay Intertechnologies
YTEOL:
5
Avalanche Energy Rating (Eas):
135 mJ
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
60 V
Drain Current-Max (ID):
50 A
Drain-source On Resistance-Max:
0.0155 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code:
TO-252
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
175 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
P-CHANNEL
Pulsed Drain Current-Max (IDM):
200 A
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
MATTE TIN
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30
Transistor Element Material:
SILICON

SQD50P06-15L_GE3 Frequently Asked Questions (FAQs)

The recommended land pattern for the SQD50P06-15L_GE3 can be found in the Vishay Intertechnologies' application note 'Land Pattern Recommendations for Vishay's Power MOSFETs' (document number: 91000).
To ensure proper cooling, ensure a good thermal interface between the device and the heat sink, use a thermal interface material (TIM) such as thermal grease or thermal tape, and design the heat sink to provide adequate airflow.
The maximum allowed power dissipation for the SQD50P06-15L_GE3 is dependent on the ambient temperature and the thermal resistance of the system. Refer to the datasheet for the power dissipation curves and thermal resistance values.
Yes, the SQD50P06-15L_GE3 is a qualified device for high-reliability applications. It is manufactured and tested to meet the requirements of the automotive and industrial markets.
To protect the SQD50P06-15L_GE3 from ESD, handle the device in an ESD-controlled environment, use ESD-protective packaging and handling materials, and ensure that all personnel handling the device are grounded.

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