The recommended PCB footprint for SQJQ980EL-T1_GE3 is a rectangle with dimensions 2.5 mm x 1.3 mm, with a pad size of 1.5 mm x 0.8 mm and a spacing of 0.5 mm between pads.
To handle thermal management, ensure good thermal conductivity between the device and the PCB by using a thermal pad or thermal interface material. Also, consider using a heat sink or a thermal management system to keep the junction temperature below 150°C.
The maximum allowed voltage derating for SQJQ980EL-T1_GE3 is 80% of the rated voltage, which is 980 V. Therefore, the maximum allowed voltage derating is 784 V.
Yes, SQJQ980EL-T1_GE3 is suitable for high-frequency applications up to 1 MHz. However, it's essential to consider the device's parasitic capacitance and inductance, as well as the PCB layout, to minimize high-frequency losses.
To ensure reliability in a humid environment, follow proper storage and handling procedures, and consider using a conformal coating or potting compound to protect the device from moisture. Also, ensure the device is operated within the recommended temperature and humidity ranges.
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SQJQ980EL-T1_GE3 Overview
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