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SQM100N10-10_GE3 - Vishay

Description: MOSFET 100V 100A 375W AEC-Q101 Qualified

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SQM100N10-10_GE3 - Vishay - PCB symbol
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PCB Footprints
SQM100N10-10_GE3 - Vishay PCB footprint - Other - Other - TO-263 (D2PAK) 3-LEAD
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SQM100N10-10_GE3 - Vishay - 3D model - Other - TO-263 (D2PAK) 3-LEAD
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SQM100N10-10_GE3 Details

  • Manufacturer Part Number:

    SQM100N10-10_GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, TO-263, 3 PIN

  • Country Of Origin:

    Germany

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    280 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    100 A

  • Drain-source On Resistance-Max:

    0.0105 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Element Material:

    SILICON

SQM100N10-10_GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SQM100N10-10_GE3 is a 6-pin SOT-223 package with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the component.
  • The maximum allowed power dissipation for the SQM100N10-10_GE3 is 100W, but this can be increased to 150W with proper heat sinking and thermal management.
  • Yes, the SQM100N10-10_GE3 is suitable for high-reliability applications, such as aerospace, defense, and medical devices, due to its high-quality manufacturing process and rigorous testing procedures.
  • To prevent ESD damage, handle the SQM100N10-10_GE3 with anti-static wrist straps, mats, or bags, and ensure that the PCB and assembly process are ESD-compliant.

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SQM100N10-10_GE3 Overview

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