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SQM35N30-97_GE3 - Vishay

Description: MOSFET N-Chnl 300-V (D-S) AEC-Q101 Qualified

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SQM35N30-97_GE3 - Vishay PCB footprint - Other - Other - SQM35N30-97_GE3-1
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SQM35N30-97_GE3 Details

  • Manufacturer Part Number:

    SQM35N30-97_GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-263, D2PAK-3/2

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.65

  • Avalanche Energy Rating (Eas):

    54 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    300 V

  • Drain Current-Max (ID):

    35 A

  • Drain-source On Resistance-Max:

    0.097 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    185 pF

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    75 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    83 ns

  • Turn-on Time-Max (ton):

    90 ns

SQM35N30-97_GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for SQM35N30-97_GE3 is a 5-pin TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pins. Avoid applying excessive force or pressure during soldering.
  • The maximum allowed power dissipation for SQM35N30-97_GE3 is 150W, but it's recommended to derate the power dissipation to 100W or less to ensure reliable operation.
  • Yes, SQM35N30-97_GE3 is suitable for high-frequency switching applications up to 100 kHz, but it's essential to consider the device's switching losses, gate charge, and thermal performance.
  • To protect SQM35N30-97_GE3 from ESD, handle the device with an anti-static wrist strap or mat, and ensure that the PCB and components are properly grounded. Avoid touching the device's pins or leads.

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SQM35N30-97_GE3 Overview

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