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SQM40010EL_GE3 - Vishay

Description: N-Channel 40 V 120A (Tc) 375W (Tc) Surface Mount TO-263 (D²Pak)

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SQM40010EL_GE3 - Vishay PCB footprint - Other - Other - TO-263 (D2PAK)-1
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SQM40010EL_GE3 Details

  • Manufacturer Part Number:

    SQM40010EL_GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TO-263, D2PAK-3/2

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2016-07-19

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    320 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    120 A

  • Drain-source On Resistance-Max:

    0.0016 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    1900 pF

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    300 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    115 ns

  • Turn-on Time-Max (ton):

    55 ns

SQM40010EL_GE3 Frequently Asked Questions (FAQs)

  • Vishay recommends a PCB layout with a thermal pad connected to a large copper area to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
  • To ensure reliable soldering, Vishay recommends using a soldering temperature of 260°C (500°F) for a maximum of 10 seconds. The component should be soldered using a solder with a melting point of 217°C (423°F) or higher. Additionally, the PCB should be designed with a solder mask to prevent solder bridging.
  • Vishay recommends derating the maximum voltage by 10% to ensure reliable operation. For example, if the maximum voltage rating is 1000 V, the derated voltage would be 900 V.
  • Vishay recommends handling the SQM40010EL_GE3 with ESD-protective equipment and following proper ESD-handling procedures to prevent damage. The component should be stored in an ESD-protective package, and personnel should wear ESD-protective wrist straps or clothing when handling the component.
  • Vishay recommends storing the SQM40010EL_GE3 in a dry, cool place with a temperature range of -40°C to 30°C (-40°F to 86°F) and a relative humidity of 60% or less. The component should be stored in its original packaging or an ESD-protective package to prevent damage.

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SQM40010EL_GE3 Overview

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