The recommended PCB footprint for the SQP90P06-07L_GE3 is a pad layout with a minimum size of 1.5 mm x 1.5 mm, with a thermal pad size of 2.5 mm x 2.5 mm. The pad spacing should be at least 0.5 mm.
To ensure reliability in high-temperature applications, it is recommended to derate the power dissipation of the SQP90P06-07L_GE3 according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below 150°C.
The maximum allowable voltage transient for the SQP90P06-07L_GE3 is 80 V for a duration of up to 100 ms. Exceeding this limit may cause damage to the device.
Yes, the SQP90P06-07L_GE3 can be used in switching applications, but it is essential to ensure that the device is operated within its safe operating area (SOA) to prevent damage. The SOA is defined by the maximum voltage, current, and power dissipation ratings.
To handle ESD protection for the SQP90P06-07L_GE3, it is recommended to follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging. The SQP90P06-07L_GE3 has an ESD rating of 2 kV human body model (HBM) and 150 V machine model (MM).
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
SQP90P06-07L_GE3 Overview
Use the download button to access the SQP90P06-07L_GE3 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SQP90,
or try a keyword search, such as Power Field-Effect Transistors
