- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SR3200-T
- Part Number SR3200-T
- Manufacturer Rectron
- Pin Count 2
- Part Category Schottky Diode
- Package Category Diodes, Axial Diameter Horizontal Mounting
- Footprint Name Diodes, Axial Diameter Horizontal Mounting - DO-201AD
- Released Date Sep 11, 2020
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
SR3200-T Details
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Manufacturer Part Number:
SR3200-T
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8541.10.00.80
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Manufacturer:
Rectron Semiconductor
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YTEOL:
5.99
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Additional Feature:
HIGH RELIABILITY
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Application:
GENERAL PURPOSE
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Case Connection:
ISOLATED
SR3200-T Frequently Asked Questions (FAQs)
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A good PCB layout for the SR3200-T should include a large copper area for heat dissipation, with multiple vias connecting the top and bottom layers. The component should be placed near a corner of the board to allow for maximum airflow. Additionally, a thermal relief pattern can be used to reduce thermal resistance.
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To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for voltage and current. Additionally, the device should be mounted on a heat sink with a thermal interface material, and the PCB should be designed to minimize thermal resistance. Regular cleaning and maintenance can also help prevent thermal runaway.
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Exceeding the maximum junction temperature (Tj) of 150°C can lead to a reduction in the device's lifespan, increased thermal resistance, and potentially even catastrophic failure. Prolonged operation above the maximum Tj can cause the device to degrade, leading to reduced performance, increased leakage current, and eventual failure.
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Yes, the SR3200-T can be used in switching regulator applications, but it's essential to ensure that the device is operated within its safe operating area (SOA). The device's voltage and current ratings should not be exceeded, and the switching frequency should be limited to minimize switching losses.
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To select the correct heat sink for the SR3200-T, consider the device's power dissipation, ambient temperature, and airflow. A heat sink with a high thermal conductivity, such as copper or aluminum, is recommended. The heat sink should be sized to maintain a junction temperature below the maximum rating, and thermal interface material should be used to minimize thermal resistance.
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SR3200-T Overview
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