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SRN1060-470M - Bourns

Description: Bourns SRN1060 Series Shielded Wire-wound SMD Inductor with a Ferrite Core, 47 μH ±20% 2.5A rms Idc

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Symbol
SRN1060-470M - Bourns - PCB symbol
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PCB Footprints
SRN1060-470M - Bourns PCB footprint - Inductors Chip - Inductors Chip - SRN1060
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3D Models
SRN1060-470M - Bourns - 3D model - Inductors Chip - SRN1060
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SRN1060-470M Details

  • Manufacturer Part Number:

    SRN1060-470M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6.9

  • Case/Size Code:

    3939

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.11 Ω

  • Inductance-Nom (L):

    47 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    6 mm

  • Package Length:

    10 mm

  • Package Style:

    SMT

  • Package Width:

    9.8 mm

  • Packing Method:

    TR, Embossed , 13 Inch

  • Rated Current-Max:

    2.5 A

  • Self Resonance Frequency:

    6 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRN1060-470M Frequently Asked Questions (FAQs)

  • A symmetrical layout with a central ground plane and minimal track lengths is recommended. Keep the input and output tracks separate and avoid crossing them over each other.
  • Ensure good airflow around the component, avoid overheating nearby components, and consider using a heat sink if the device is expected to operate in high-temperature environments.
  • A reflow soldering profile with a peak temperature of 240°C to 250°C and a dwell time of 20-30 seconds is recommended. Avoid exceeding 260°C to prevent damage to the component.
  • Yes, but ensure the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent mechanical stress and vibration-induced failure.
  • Use a multimeter to measure voltage and current at the input and output pins. Check for signs of overheating, physical damage, or incorrect PCB layout. Consult the datasheet and application notes for guidance on troubleshooting common issues.

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SRN1060-470M Overview

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