SRN2010TA-1R0Y footprint, schematic symbol and 3D model by Bourns

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SRN2010TA-1R0Y Details

The recommended land pattern for the SRN2010TA-1R0Y can be found in the Bourns application note AN-13, which provides guidelines for PCB layout and land pattern design.
The SRN2010TA-1R0Y has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. A thermal pad on the bottom of the device can be connected to a copper plane on the PCB to dissipate heat.
The maximum current rating for the SRN2010TA-1R0Y is 1A. However, it's essential to consider the power rating and thermal considerations to ensure the device operates within its specified limits.
The SRN2010TA-1R0Y is designed for general-purpose applications and may not be suitable for high-frequency applications. For high-frequency applications, consider using a device specifically designed for high-frequency operation, such as the Bourns SRN3010TA-1R0Y.
To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the Bourns application note AN-12. Additionally, use a solder with a melting point compatible with the device's temperature rating.

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